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Wafer Making Machine
Wafer Making Machine
Wafer Making Machine
Wafer Making Machine
Wafer Making Machine
Wafer Making Machine

Wafer Making Machine

Price 25000 INR/ Unit

Wafer Making Machine Specification

  • Power Source
  • Electric
  • Automation Grade
  • Automatic
  • General Use
  • Industrial
  • Material
  • Stainless Steel
  • Capacity
  • 40-180 Kg/hr
  • Computerized
  • No
  • Automatic
  • Yes
  • Voltage
  • 230/440 Volt (v)
  • Feature
  • ECO Friendly, Low Noice, Lower Energy Consumption, Compact Structure, High Efficiency
  • Color
  • Sliver
  • Warranty
  • 1 Year
 

Wafer Making Machine Trade Information

  • Minimum Order Quantity
  • 1 Unit
  • Payment Terms
  • Cash Against Delivery (CAD), Cash Advance (CA), Cash in Advance (CID), Cheque, Western Union
  • Main Export Market(s)
  • Asia, Australia, Central America, North America, South America, Eastern Europe, Western Europe, Middle East, Africa
  • Main Domestic Market
  • All India, South India, Central India, West India, North India, East India, Gujarat, Karnataka, Kerala, Lakshadweep, Mizoram, Meghalaya, Manipur, Andhra Pradesh, Bihar, Chandigarh, Daman and Diu, Goa, Jharkhand, Odisha, Punjab, Assam, Delhi, Dadra and Nagar Haveli, Andaman and Nicobar Islands, Arunachal Pradesh, Chhattisgarh, Haryana, Himachal Pradesh, Jammu and Kashmir, Madhya Pradesh, Maharashtra, Nagaland, Rajasthan, Sikkim, Tamil Nadu, Telangana, Tripura, Pondicherry, Uttar Pradesh, Uttarakhand, West Bengal
  • Certifications
  • ISO
 

About Wafer Making Machine

Here's an overview of how these machines typically work:

  1. Preparation of Batter: A batter or dough mixture is prepared according to the specific recipe for wafers. This mixture often includes ingredients like flour, water, sugar, and sometimes fats or oils.

  2. Mixing and Consistency: The batter must be thoroughly mixed to achieve a consistent texture. This is crucial for ensuring uniformity in the wafer's thickness and texture.

  3. Baking Process: The mixed batter is then evenly spread onto a baking plate or grid. The baking plates are heated to a precise temperature to cook the batter evenly and create the desired crispness. The baking time and temperature are critical factors in determining the final quality of the wafer.

  4. Cooling and Removal: Once baked, the wafer sheets are carefully cooled to set their shape and texture. They are then removed from the baking plates using automated mechanisms that ensure minimal breakage.

  5. Cutting and Shaping: After cooling, the large sheets of wafer are often cut into smaller, uniform shapes using cutting machines. These machines can cut wafers into various sizes and shapes depending on the final product specifications.

  6. Packaging: Finally, the wafers are packaged either individually or in bulk for distribution and sale. Packaging may include sealing in pouches or boxes to maintain freshness and prevent breakage.

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